September 9-11, 2026
Shenzhen World Exhibition & Convention Center Shenzhen, China
As the AI race moves beyond million-cluster GPU scale, the battleground for computing infrastructure is quietly shifting from chip fabrication processes to interconnect efficiency. Co-packaged optics (CPO) – the key technology to break through the interconnect bottleneck of AI compute clusters – is moving rapidly from lab validation to commercial-scale deployment this year.
Join us at CIOE 2026 to explore the complete CPO ecosystem, from core components to full system solutions. At the sub expo - Information & Communication Expo, you'll witness world‑class demonstrations of silicon photonic chips, high‑performance optical engines, and advanced integrated packaging purpose‑built for AI data centers.
Propelled by the explosive growth of AI large models, high-performance computing (HPC), and 5G networks, data center bandwidth demand increases by over 30% annually. Constrained by high power consumption, excessive latency, and low bandwidth density, traditional copper interconnection can no longer satisfy the demands of the AI era.
IDC statistics indicate around 30% of data center power consumption stems from interconnection systems, while copper cable latency exceeds that of optical fiber by more than tenfold. Against this backdrop, Co-packaged Optics (CPO) has emerged as a pivotal solution. By integrating optical engines with switching and computing ASICs on a single substrate, CO enables chip-level optical interconnection to overcome critical data transmission bottlenecks.
Market demand for CPO is growing exponentially. Yole projects the global CPO market will expand from approximately USD 46 million in 2024 to USD 8.1 billion by 2030, representing a CAGR of 137%. Key growth drivers include soaring bandwidth requirements in AI data centers (expected to reach 100 Tbps by 2027), high-capacity demands for 5G base stations, and low-latency requirements for intelligent driving. Positioned to address these needs, CPO is set to become the mainstream architecture for next-generation data interconnection.
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GlobalFoundries - Sivers & GlobalFoundries Advance AI Data Center Optical SolutionsThe collaboration supports a range of optical connectivity architectures, including co-packaged optics (CPO), linear pluggable optics (LPO), and other emerging data center interconnect solutions.
Broadcom – Broadcom Accelerates the AI Era with the Industry’s First End-to-End 50G PON Edge AI PortfolioThis launch completes the industry’s most advanced wireless broadband portfolio, pairing 50G PON with a durable Wi-Fi 8 foundation established across four successive waves of market-leading innovation.
Eoptolink – Eoptolink is using Broadcom's Industry First 400G/lane Optical DSP for Next-Generation 1.6T transceivers3nm 400G/lane technology enables best-in-class 1.6T transceivers and lays the foundation for 204.8T networks using 3.2T transceivers
T&S – T&S Introduces 800G OSFP MMC Interface Optical TransceiverT&S has launched a newly engineered 800G optical transceiver featuring an MMC optical interface, designed to meet the evolving demands of high-performance data centers and next-generation network infrastructures.
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