September 9-11, 2026
Shenzhen World Exhibition & Convention Center
Shenzhen, China
As a core branch of the optoelectronics industry, infrared technology plays a vital role across key sectors including defense and security, industrial manufacturing, smart cities, consumer electronics, and healthcare. Looking ahead, infrared technology will continue to evolve along the directions of high performance, low consumption, miniaturization, and intelligence.
Ongoing innovations in new materials and processes will reduce the cost of core components and expand application boundaries. Moreover, the deep integration of infrared technology with AI will enable autonomous recognition, intelligent alerting, and data-driven decision-making—shifting the paradigm from passive sensing to active intelligence.
CIOE 2026 will be the premier platform to explore breakthrough innovations in infrared materials, advanced detectors, and manufacturing technologies. Join us to see the future of infrared application up close!
As infrared core devices become more affordable and high-performing, the technology is rapidly expanding from industrial safety to autonomous driving and consumer electronics. In industrial settings, infrared gas imaging enables rapid, visual screening of hazardous leaks. In autonomous driving, short-wave infrared (SWIR) provides reliable fog and night vision along with material identification, positioning it as a future standard for
perception systems. In consumer electronics, SWIR chip promises to transform low-light photography, with SWIR-enabled smartphones expected within one to two years.
The Infrared Applications Expo is one of our key themed exhibition, showcasing the innovative materials and devices to sophisticated equipment and applications in infrared, ultraviolet, and terahertz technologies. Join us to scout for innovative products, exchange state-of-the-art technologies, and identify upcoming trends!
InfraTec - Measurement of Thermal Stress-induced Deformation of Electronic Circuit Boards
Modern electronic circuit boards and electronic components enable ever-increasing data transfer volumes and faster processing speeds. As a result, power consumption and heat generation often increase, which frequently leads to warping of the mounting board.
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GHOPTO - Silicon Wafer Inspection With SWIR Camera
Utilizing Infrared Imaging technology can highlight internal defects in silicon wafers, such as cracks and impurities. SWIR wafer inspection helpful in the detection and identification of cracks within silicon wafers, enabling the early discovery of potential issues.
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CIOE 2026 will host a series of forums featuring multiple dedicated tracks that cover industrial deployment, including detection technologies, intelligent inspection, and safety operation. Specific topics are as follows:
For any questions or inquiries regarding CIOE 2026, feel free to scan the QR code and contact us directly via WhatsApp!
