One pass for three shows – unlock the complete AI computing chain

In 2026, CIOE, IICIE, and elexcon will be held concurrently on September 9–11 in Shenzhen. With complementary positioning and deeply interconnected supply chains, the three shows weave a complete pathway from foundational materials to market applications. One badge grants you access to all three exhibitions.

Why You Can't Miss This Triple-Show Event

Unprecedented Scale: 340,000 sqm of exhibition space, 5,000+ exhibitors, and 240,000+ professional attendees spanning optoelectronics, integrated circuits, and embedded electronics.
One-Stop Access to the Full Chain: Computing operators, cloud providers, server manufacturers, and AI model teams can find silicon photonics, CPO optical interconnects, HBM high-speed memory, embedded system solutions, semiconductor materials and equipment – all in one venue.
Cross-Sector Collaboration: Optical chip companies can directly connect with foundries and advanced packaging providers; packaging and testing equipment suppliers can tap into both silicon photonics and HBM storage markets; storage and system manufacturers can source high-speed optical modules and optoelectronic integrated components in one place.

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The Optical Interconnect Hub for AI Computing Clusters

CIOE – Information and Communication Expo spotlights core technologies that directly address the bandwidth and power consumption bottlenecks of AI computing clusters.

Part of Exhibiting Products

*The products are listed in no particular order. Click here to find more.

CIOE bridges upward to IICIE's semiconductor manufacturing and advanced packaging resources, and connects to elexcon's computing systems and storage partners – completing the chain from silicon photonic chip fabrication to CPO packaging integration, and the final high-speed optical interconnect deployment.

Who Will You Meet?

• 3M

• ACACIA

• ACCELINK

• AFR

• ALUVIA

• ANRITSU

• ASMPT

• AVNET

• BELDEN

• BROADCOM

• CIG

• CISCO

• COHERENT

• CORNING

• CREDO

• EOPTLINK

• EVERBRIGHT

• EXFO

• FICONTEC

• GLOBALFOUNDRIES

• HG GENUINE

• HISILICON

• KEYSIGHT

• LIGENT

• LIGENTEC

• LINKTEL

• LIOBATE

• LIONIX

• LUCEDA PHOTONICS

• LUXSHARE-TECH

• MACOM

• MARVELL

• MITSUBISHI

• ELECTRIC MRSI

• MULTILANE

• MURATA

• O-NET

• OPTOWIDE

• PHOGRAIN

• POET

• R&S

• ROSENBERGER

• SEMTECH

• SENKO

• SIFOTONICS

• SILUX

• SOURCE

• TACLINK

• TERADYNE

• TFC

• TOWER

• VIAVI

• YOKOGAWA

*Exhibitors are listed in alphabetical order.

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The Foundational Engine for Silicon Photonics and CPO Advances

As a dedicated platform covering the full semiconductor value chain,the International Integrated Circuit Innovation Expo (IICIE) provides the critical process foundation.

1 Materials & Equipment for Mass Production – On‑site exhibits cover SOI wafers, photoresists, specialty substrates, along with lithography system, etchers, deposition, and other optical testing equipment – directly addressing the capability gaps in silicon‑photonics volume manufacturing.

2 Advanced Packaging for Optoelectronic Integration – Heterogeneous technologies (CoWoS, SoIC, hybrid bonding, TSV stacking) enable high‑density co‑packaging of photonic and electronic chips, driving CPO technology toward mature mass production.

3 Full‑Domain Convergence across the Supply Chain – The co‑location connects fabs, OSATs, CIOE's optical module vendors, and elexcon's memory suppliers, creating a seamless “IC fabrication → optoelectronics → storage” ecosystem that solves process adaptation and yield challenges.

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