September 9-11, 2026
Shenzhen World Exhibition & Convention Center
Shenzhen, China
The industry is witnessing a profound transformation. Optical test and measurement is no longer a supporting player—it's taking center stage as the driving force behind next-generation manufacturing. From freeform surface metrology powering AR/VR waveguides to batch calibration of automotive LiDAR systems. From sub-micron non-destructive inspection of TSV vias in advanced packaging to high-speed testing of 1.6T optical transceivers—optical measurement technology has become the indispensable catalyst for breakthrough innovation and industrial-scale production.
CIOE 2026's Precision Optics Expo & Camera Expo brings this revolution to life, showcasing the complete optical test and measurement ecosystem under one roof. Discover the technologies shaping tomorrow's industries. Act now to join us!
Optical measurement and inspection now penetrate virtually every high‑end manufacturing sector, including semiconductor wafer inspection, optical communication module testing, consumer electronics precision metrology, and automotive LiDAR calibration.
✅Semiconductor Inspection: Advanced packaging is a core growth track for China's semiconductor industry. High-precision chip production is driving denser, miniaturized, stacked packaging processes. While overseas giants have dominated high-end inspection, domestic players like Skyverse are closing the technology gap, creating a golden window for import substitution.
✅ Optical Communication Testing: AI computing power is driving explosive demand for optical modules. TrendForce projects the AI optical module market will reach USD 26 billion in 2026, up 57.6% year-over-year. The global market for 800G+ optical module equipment is estimated at USD 6.7 billion for 2026 - 2028. With test equipment representing 27% - 33% of total investment, the annual market for optical communication test equipment during 2026 - 2028 is approximately USD 3.5 billion.
Optical measurement and inspection now penetrate virtually every high‑end manufacturing sector, including semiconductor wafer inspection, optical communication module testing, consumer electronics precision metrology, and automotive LiDAR calibration.
ZEISS – Quality Innovation Powering AI
Behind every AI interaction are massive data centers powered by thousands of GPUs. As systems scale from chip to rack, defects in semiconductor packaging, printed circuit boards (PCB/A), cooling systems and high-speed interconnects can affect uptime, deployment speed and total cost…
Taylor Hobson – Advancing 3D optics metrology with NEW automatic part setup
The LUPHOScan 260 sets a new benchmark in optical metrology, delivering fast, ultra-precise, non-contact 3D surface measurements for both rotationally symmetric and non-rotationally symmetric surfaces—including aspheric lenses, spheres, flats, and freeforms…
TRIOPTICS - New measurement system for objective and economical inspection of optical surfaces
SurfInspect is designed for companies that manufacture or further process optical components and assemblies. It is particularly suitable for companies that currently perform manual visual inspections and are searching for a cost-effective alternative…
Motic – Choosing the Right Microscope for Industrial and Material Sciences Applications
The right microscope helps professionals observe surface finishes, internal structures, and small defects that aren’t visible to the naked eye. Different applications require different types of microscopes, and it’s important to understand what each model offers before making a decision…
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