For decades, when the semiconductor industry comes to lithography, the immediate reflex was DUV and EUV. But the economics of scaling have reached their limits, and nanoimprint lithography (NIL) is emerging as a powerful complementary route, particularly in cost-sensitive segments like optical chips and NAND flash memory.
On June 5, 2026, Prinano Technology delivered the PL-AS Wafer-Scale Semiconductor-Grade (NIL) System to Litratech — and simultaneously announced verified mass production of 8-inch optical chip wafers based on this equipment. The entire manufacturing process completely bypasses DUV lithography and reduces per-chip manufacturing costs to one-tenth of traditional DUV solutions.
As one of the 4,000+ exhibitors of CIOE 2026, we invite you to join us this September 9–11 to witness, connect, and shape the future of optoelectronic manufacturing.
Key Features & Verified Segments
Prinano’s nanoimprint solutions have completed customer validation across key optical chip segments:
1⃣ LiDAR chips: Lince Technology has achieved mass production of 18mm OPA chips using PL-AS technology, accelerating the commercialization of solid-state LiDAR applications.
2⃣ Optical communication / sensing chips (GaAs/InP): Composite template nanoimprint technology has overcome the brittleness of GaAs/InP substrates, enabling Bragg grating manufacturing for leading customers.
3⃣ Silicon photonic chips: Mass production process validation has been achieved for ring waveguide structures on 8-inch wafers. Cross-scale structures ranging from 150nm to 10μm are formed in a single step.
In optical chips, nanoimprint has become the preferred mass-production solution with superior cost advantages over DUV.
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